Lead Free Reflow Oven 24 Heading Zone 2 Cooling Zone Reflow Soldering Equipment
2025-07-23 10:04:51
Model NO.: GSD-L12
Features:The GSD-L12 reflow oven is equipped with a Windows-based operating interface and offers two control methods: PC control and emergency manual control. This dual-control system ensures the safety and reliability of the device during operation.
It uses an advanced heating method that eliminates dead zones commonly encountered during reflow soldering, ensuring even heat distribution and better solder joint quality.
The professional wind wheel design provides stable blowing speed, preventing uneven airflow during PCB heating. This enhances the efficiency of the reheating process and improves overall performance.
Each temperature zone operates independently with its own PID control and up/down heating method, ensuring precise and uniform temperature control across the furnace, along with a large thermal capacity for consistent performance.
The heating preservation layer uses high-quality aluminum silicate insulation material, offering excellent heat retention and fast heating speeds. It can reach working temperature within 20 minutes from room temperature, saving time and energy.
The high-temperature, high-speed motor runs smoothly with minimal vibration and low noise, ensuring long-term stability and user comfort.
The furnace is supported by a cylinder and safety rod, making it safe and easy to operate, especially in case of emergencies or maintenance.
The PCB conveyor system uses variable frequency and speed control, combined with a synchronized grid and chain mechanism, ensuring smooth and stable movement of the board during the process.
Special high-quality aluminum alloy guide rails are used, along with an automatic fuel feeding system, which guarantees accurate alignment and extends the lifespan of the guide rail system.
An integrated UPS function ensures continuous PCB output even after a power failure, protecting the product from damage and minimizing production downtime.
The software features powerful capabilities, allowing real-time temperature monitoring of the PCB, data analysis, storage, and printing of temperature curves over time, enhancing process control and traceability.
The PC and PLC communicate via the PC/PP protocol, ensuring stable operation and reducing the risk of system crashes. The device also includes auto-detection and status display functions for real-time monitoring.
The furnace liner is specially designed for optimal heat retention and low energy consumption, contributing to both efficiency and cost-effectiveness.
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