Semiconductor and electronics manufacturing technical experts draw a blueprint for future development
2019-10-29 15:01:50
[China Instrument Network Instrumentation Upstream] At the SEMI China Packaging and Metering Committee earlier, technical experts from the semiconductor and electronics manufacturing industries proposed a blueprint for the future development of semiconductor packaging and testing technology for the evolution of the electronics industry. Huawei's chief packaging expert, Fu Huili, pointed out that in the mobile and IoT markets, competition for system space has led to the proliferation of various wafer-level packages and their combinations.
Fu Huili said that fabs must take into consideration the encapsulation when controlling the size of the chip, and the package design specifications can no longer leave a margin. Evolving to today's complexity, it is difficult for design companies to use traditional yield and cost concepts to require packaging. Instead, wafer manufacturing and packaging technology should be linked to pursue the best price-performance ratio.
In this conference, technical experts from the field of core design and manufacturing all presented major challenges for the development of current chips. Gong Jie, a participating technical expert at Spreadtrum, pointed out that when the chip size is smaller and smaller, the difference between the package and the front road is more blurred, then how does Zhongdao and Houdao compete with the former for high-tech packaging? Xiao Zhilu from Huatian also pointed out that the packaging plant and Fab are entering the middle road process. The Fab carries advanced technology and advantageous capital. How will the packaging be developed after going to 3D?
The middle section is the integration and progress of the former and latter sections in the traditional sense. The current trend is that chips are getting cheaper and more expensive. Xu Wei from Hua Hong Group said, and Cui Dong from SMIC Changjiang also pointed out that China has started manufacturing, cooperation in the industrial chain is getting closer, the middle market is large, and the demand is diversified and multi-layered. Each will give full play to its advantages to promote the development of the entire industry.
In addition, at the seminar, Ju Long, a vice president of SEMI and a president of China, pointed out that the international media had made some comments on the Chinese-funded acquisitions. The related projects and amounts are still less than 10% of the total amount of industrial mergers and acquisitions.
Regarding China’s continuous improvement in its position in the global semiconductor market, Fu Huili said that there are already 20 new fabs in the country, which represents an excellent opportunity for domestic packaging plants. Opportunities are there, but you need to take the direction and invest prudently. Fudan Microelectronics Ma Qingrong believes that IDM or virtual IDM is a major trend. Design companies need to integrate with each other, and design and manufacturing should be vertically integrated. Tongfu Microelectronics Shi Lei: Packaging, testing, fabs, and design companies are all partners. Common customers are system vendors. Self-controllability is not the same as fully state-owned. TF-AMD is an international cooperation and common development model.
At the same time, manufacturers have innovative ideas for the future development of semiconductors in the future. Shi Minghua, a representative from SMIC, pointed out that whether the company has more suggestions for Jingyuan Plant? If the memory directly to the IC is not on the package to connect it? He said that he did not have to wait until he saw the right thing, and he must try to do it. Liu Hongjun, a representative from Crystal, believes that free hardware is a common challenge that everyone must face.
The focus of foreign investors is also focused on local labor costs. TI's Zhang Guanghua proposed how to deal with the challenges of rising labor costs and fast flow in China. Amkor Zhou Xiaoyang believes that everyone, whether domestic or foreign, is working hard on China's hot land. Foreign capital has trained many local Chinese talents and has also driven the development of local technology. Qualcomm Zheng Zhaohui pointed out that technology determines quality, technology determines cost, and packaging technology determines your threshold and profitability. The industry's top 3 share most of its profits is a good indication.
However, Guo Yifan from ASE believes that package yield is the key, and the increase in finished product rate is the key to enhancing international competitiveness. Han Hao Ye Zhaoping: Taiwan's regional packaging industry uses half of the equipment supplied by the local market, and China’s current equipment country production rate is less than 10%. .
Fu Huili said that fabs must take into consideration the encapsulation when controlling the size of the chip, and the package design specifications can no longer leave a margin. Evolving to today's complexity, it is difficult for design companies to use traditional yield and cost concepts to require packaging. Instead, wafer manufacturing and packaging technology should be linked to pursue the best price-performance ratio.
In this conference, technical experts from the field of core design and manufacturing all presented major challenges for the development of current chips. Gong Jie, a participating technical expert at Spreadtrum, pointed out that when the chip size is smaller and smaller, the difference between the package and the front road is more blurred, then how does Zhongdao and Houdao compete with the former for high-tech packaging? Xiao Zhilu from Huatian also pointed out that the packaging plant and Fab are entering the middle road process. The Fab carries advanced technology and advantageous capital. How will the packaging be developed after going to 3D?
The middle section is the integration and progress of the former and latter sections in the traditional sense. The current trend is that chips are getting cheaper and more expensive. Xu Wei from Hua Hong Group said, and Cui Dong from SMIC Changjiang also pointed out that China has started manufacturing, cooperation in the industrial chain is getting closer, the middle market is large, and the demand is diversified and multi-layered. Each will give full play to its advantages to promote the development of the entire industry.
In addition, at the seminar, Ju Long, a vice president of SEMI and a president of China, pointed out that the international media had made some comments on the Chinese-funded acquisitions. The related projects and amounts are still less than 10% of the total amount of industrial mergers and acquisitions.
Regarding China’s continuous improvement in its position in the global semiconductor market, Fu Huili said that there are already 20 new fabs in the country, which represents an excellent opportunity for domestic packaging plants. Opportunities are there, but you need to take the direction and invest prudently. Fudan Microelectronics Ma Qingrong believes that IDM or virtual IDM is a major trend. Design companies need to integrate with each other, and design and manufacturing should be vertically integrated. Tongfu Microelectronics Shi Lei: Packaging, testing, fabs, and design companies are all partners. Common customers are system vendors. Self-controllability is not the same as fully state-owned. TF-AMD is an international cooperation and common development model.
At the same time, manufacturers have innovative ideas for the future development of semiconductors in the future. Shi Minghua, a representative from SMIC, pointed out that whether the company has more suggestions for Jingyuan Plant? If the memory directly to the IC is not on the package to connect it? He said that he did not have to wait until he saw the right thing, and he must try to do it. Liu Hongjun, a representative from Crystal, believes that free hardware is a common challenge that everyone must face.
The focus of foreign investors is also focused on local labor costs. TI's Zhang Guanghua proposed how to deal with the challenges of rising labor costs and fast flow in China. Amkor Zhou Xiaoyang believes that everyone, whether domestic or foreign, is working hard on China's hot land. Foreign capital has trained many local Chinese talents and has also driven the development of local technology. Qualcomm Zheng Zhaohui pointed out that technology determines quality, technology determines cost, and packaging technology determines your threshold and profitability. The industry's top 3 share most of its profits is a good indication.
However, Guo Yifan from ASE believes that package yield is the key, and the increase in finished product rate is the key to enhancing international competitiveness. Han Hao Ye Zhaoping: Taiwan's regional packaging industry uses half of the equipment supplied by the local market, and China’s current equipment country production rate is less than 10%. .
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