Semiconductor manufacturing bred new opportunities Changes in new technologies are inevitable

The semiconductor industry has entered the 14nm process, mass production in 2014. Conventional photolithographic 193 nm immersion using a DPI technique of twice or four may reach 10 nm from a process node, which means that if the EUV technology is deferred again, the 2015 process will be temporarily at 10nm wandering. Unless the EUV technology is mature, the process can continue to shrink. According to the current situation, even if the success of the EUV there are at most two steps, namely 7nm or 5nm. Because according to the theoretical calculation, the device may reach the physical limit at 5nm.

Process size reduction is only one of the means, not the ultimate goal. As we all know, to promote market progress is the market demand for end-use electronics , toward smaller, lighter, lower cost, easier to use direction. IDC released this year on the 2020 global smart device forecast data show that one will use the Internet will reach 4 billion, the second is the industry sales of 4 trillion US dollars, and third, 25 billion embedded terminal devices, four Is the need to deal with the amount of data up to 50 trillion GB, the fifth is the global application of 25 million.

Recently, the world has been able to continue to track the number of advanced manufacturing process less and less, focusing on several leading manufacturers, respectively, the logic of Intel, Samsung memory, SK hynix, Toshiba, SanDisk and generation Workers TSMC, Grosvenor, etc., the industry triumphantly tripartite structure has been basically formed. The main driving force for their development is to keep the leading position and prevent followers from surpassing them. Therefore, in most cases, their continuous investment and follow-up are necessary. Although they are not related to the driving force behind the reduction in process size, they are not obvious. Because even though Moore's Law has reached the end, the impact on them is minimal.

In addition, with the exception of FinFET (3D) and UT SOI (ultra-thin silicon on insulator) processes, there are still three major technologies in the global semiconductor industry in the next 10 years, which may push the industry to achieve another High growth, including 450mm silicon, EUV lithography and TSV 2.5D and 3D packaging, all of them involve the entire industry chain collaboration issues, the ability of non-single business can be solved.

450mm silicon wafer twists and turns

Due to lack of R & D funding, said 450mm equipment development has been equipped with the conditions are not objective, it seems that various manufacturers are waiting for the onset of gunfire coming.

450mm silicon fate from the beginning is bumpy, compared with the 300mm silicon, the industry continues to question the sound, summed up in the following two aspects: First, in the "big Hengda" situation, how many customers can Under orders? And 450mm equipment development needs about 20 billion US dollars investment, and its rate of return? The second is the lack of enthusiasm for equipment manufacturers.

Development does not yet have the conditions

Since 2007, the memory industry has transitioned from 200mm to 300mm silicon. In the near future, the semiconductor equipment industry has almost all orders for 300mm equipment, except for the refurbishment of 200mm equipment. Equipment industry after mergers and acquisitions again and again, now survived are all types of battle-hardened leader. Their recent days are not good, the situation is also very serious, if not included in the ranks of 450mm, it is equivalent to automatically out. Therefore, the opposition from equipment manufacturers in the past two years has almost stopped, but suffering from the lack of R & D funding is not very positive.

Due to the special nature of the equipment industry, they must be at the forefront of technology, so the chip manufacturing industry has to rely on this. According to 300mm silicon device development experience, 450mm device is not able to simply enlarge the cavity will be able to solve the problem. It is conceivable that the current customer orders will focus on 14nm or 10nm (based on its lead time) process, using FinFET or UT SOI and other processes, so many devices to re-design, at least the defect density on the silicon to reduce the two Magnitude. Coupled with the needs of the green industry, both in equipment power consumption, water consumption, size, weight, etc., there must be major improvements.

So the current progress on the 450mm equipment in addition to EUV lithography can attract people's attention, the other only measuring equipment and some other reports, are rare, I believe that all manufacturers are secretly force. However, due to the lack of R & D funding, said 450mm equipment development already have the conditions are not objective, it seems that various manufacturers are waiting for the arrival of gunfire.

Last year, Dr Yau Chiu Shan, TSMC's 450mm Program Director, mentioned the company's goal of setting 18-inch wafer devices internally. He hoped that overall device efficiency would be 1.1 times higher than that of 12-inch devices by 2018 and 1.8 times by 2020 Times In addition, the equipment price is reduced by 70%, the size is reduced by 2/3, and the average wafer per wafer can maintain the same hydropower consumption as the 300mm equipment.

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